ZBQ-E02 type metal bipolar plate and membrane electrode assembly
200 cm² active area, double seal
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Product Description
Metal Bipolar Plate Technical Parameters
| Bipolar plate thickness Bipolar plate thickness |
< 1.0mm |
Contact resistance Contact resistance |
≤ 5 mΩ/cm 2 (Test Condition: 1.5 MPa) |
| Parallelism Parallelism |
±0.01mm |
Active area size Active Area |
200 cm2 |
| Material |
SUS316L |
Substrate thickness Material thickness |
0.1/ 0.075 mm |
The second-generation metal bipolar plate features a dual-seal design, with the sealing structure manufactured via injection molding, thereby enhancing the stack’s assembly stability and service life.
It reduces the complexity of stack assembly and enhances production efficiency.
Integrated Injection Molding Sealing structure
Double sealing structure
Zhenbang High-Performance Membrane Electrode
Technical Parameters of Zenpon High Performance MEA
Platinum loading: ≤0.5 mg/cm²
Power density: ≥ 1.1 W/cm² (Peak power: 1.3 W/cm²)
Life expectancy: ≥ 5000/H
The second-generation thick-edge-frame MEA is matched with a metal bipolar plate to form a stable sealing structure, enhancing the stack’s stability. Thicker MEA & Stable sealing structure
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